DocumentCode :
3492797
Title :
Task scheduling control of BGA solder joint process in flexible manufacturing system
Author :
Alonge, F. ; Ippolito, F.D. ; Raimondi, F.M. ; Aiello, V.
Author_Institution :
Dipt. di Ingegneria dell´´Automazione e del Sistemi, Univ. of Palermo Viale delle Sci.
Volume :
2
fYear :
2005
fDate :
19-22 Sept. 2005
Lastpage :
178
Abstract :
This paper describes an open loop control method of the solder joint process in a rework station for faulty printed circuit board (PCBs) containing electronic components in packages ball grid arrays (BGAs). In particular, a mathematical model describing the solder joint process is, first of all, obtained. Then, the desired thermal profile of the junctions BGA-PCB is determined according to the physical constraints of the rework station framework. The control parameters corresponding to the above desired thermal profile are identified using the above mathematical model. Finally, the open loop control algorithm is implemented on the supervisor interface of the rework station in order to carried out experimental validation of the proposed method
Keywords :
ball grid arrays; flexible manufacturing systems; open loop systems; printed circuits; scheduling; solders; BGA; BGA solder joint process; BGA-PCB; PCB; ball grid arrays; control parameter; electronic component; flexible manufacturing system; mathematical model; open loop control method; printed circuit board; rework station framework; task scheduling control; Circuit faults; Control systems; Electronic components; Electronic packaging thermal management; Flexible manufacturing systems; Flexible printed circuits; Job shop scheduling; Mathematical model; Open loop systems; Soldering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on
Conference_Location :
Catania
Print_ISBN :
0-7803-9401-1
Type :
conf
DOI :
10.1109/ETFA.2005.1612677
Filename :
1612677
Link To Document :
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