Title :
The study of EMI for antenna-in-package
Author :
Zhang, Wenmei ; Zhang, Yueping
Author_Institution :
Shanxi Univ., Taiyuan
Abstract :
In this paper, the EMI for AiP is studied. The simulated results indicate the package will influence the performance of antenna, especially, when the ground for antenna, package and system is connected and feed from system board. At the same time, the radiation of antenna will induced the EF in packaged components and bonding trace and the MS line with different load has different response. In order to lessen the effect to packaged component from antenna, the guarding ring and vias fence are used, and the simulated results verify its validity.
Keywords :
antenna feeds; antenna radiation patterns; electromagnetic interference; packaging; EMI study; antenna feed; antenna performance; antenna radiation; antenna-in-package; guarding ring; packaged component; Antenna accessories; Antenna feeds; Antenna radiation patterns; Bonding; Dielectric substrates; Electromagnetic interference; Impedance; Loaded antennas; Microstrip antennas; Packaging;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958644
