DocumentCode
3493148
Title
A Polyimide Packaging Process For A Semiconductor Diaphragm Tactile Sensor
Author
Beebe, David J. ; Denton, Denice D. ; Webster, John G. ; Radwin, Robert G.
Author_Institution
University of Wisconsin
fYear
1990
fDate
1-4 Nov 1990
Firstpage
1058
Lastpage
1059
Keywords
Force sensors; Lead; Polyimides; Protection; Resists; Semiconductor device packaging; Sensor phenomena and characterization; Silicon; Substrates; Tactile sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1990., Proceedings of the Twelfth Annual International Conference of the IEEE
Print_ISBN
0-87942-559-8
Type
conf
DOI
10.1109/IEMBS.1990.691599
Filename
691599
Link To Document