Title :
A Polyimide Packaging Process For A Semiconductor Diaphragm Tactile Sensor
Author :
Beebe, David J. ; Denton, Denice D. ; Webster, John G. ; Radwin, Robert G.
Author_Institution :
University of Wisconsin
Keywords :
Force sensors; Lead; Polyimides; Protection; Resists; Semiconductor device packaging; Sensor phenomena and characterization; Silicon; Substrates; Tactile sensors;
Conference_Titel :
Engineering in Medicine and Biology Society, 1990., Proceedings of the Twelfth Annual International Conference of the IEEE
Print_ISBN :
0-87942-559-8
DOI :
10.1109/IEMBS.1990.691599
