Title :
Electromagnetic simulation of the EMI shield package with aperture
Author :
Kim, Su-Hwang ; Kim, Seung-Han ; Kim, Dong-Ju ; Cho, Jeong-Hoon ; Lim, Hyuk ; Jang, Jae-Hyung
Author_Institution :
Dept. of Inf. & Commun., Gwangju Inst. of Sci. & Technol. (GIST), Buk-gu
Abstract :
By employing bond-wires connecting the top cover and the PCB ground plane, the shielding effectiveness could be dramatically improved. The packages with a thicker and larger number of bond-wires exhibit better performance. At least 4 bond-wires should be inserted to prevent resonance within the third harmonic frequency for the present structure. For the same number of bond-wires, the equally spaced bond-wires exhibit the best shielding effectiveness and the highest resonance frequency. Thus, careful selection of the location, spacing and number of bond-wires can significantly improve the EMI shielding effectiveness of the RF SiP module.
Keywords :
electromagnetic interference; electromagnetic shielding; harmonic generation; lead bonding; printed circuits; EMI shield package; EMI shielding; PCB ground plane; RF SiP module; bond-wires; electromagnetic simulation; third harmonic frequency; Apertures; Bonding; Electromagnetic interference; Electromagnetic radiation; Electromagnetic shielding; Gold; Packaging; Radio frequency; Resonance; Resonant frequency;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958653
