• DocumentCode
    3493242
  • Title

    Design of single chip integration of MWNTs/SiO2 humidity sensor and its interface ASIC

  • Author

    Liu, Xiaowei ; Li, Tuo ; Yin, Liang ; Dong, Changchun

  • Author_Institution
    Dept. of Microelectron., Harbin Inst. of Technol., Harbin, China
  • fYear
    2012
  • fDate
    23-25 Aug. 2012
  • Firstpage
    470
  • Lastpage
    473
  • Abstract
    A design on single chip integration of MWNTs/SiO2 thin film humidity sensor and interface circuit based on standard IC process is presented. Humidity sensing unit on chip surface is achieved following 0.5 μm CMOS layout design rules, which ensures compatibility and reliability of the whole system. Interface circuit with phase sensitive demodulation can detect nF level capacitance and derive a proportional direct output voltage. AC signal frequency on testing system can influence interface performance and measurable peak capacitance will descend from 40 nF to less than 25 nF as frequency ascend from 5kHz to 50kHz. Hspice simulation proves ASIC interface has good linearity and low offset, and can work normally for practical MWNTs humidity sensor detection.
  • Keywords
    CMOS integrated circuits; application specific integrated circuits; carbon nanotubes; humidity sensors; integrated circuit layout; integrated circuit reliability; silicon compounds; thin film sensors; AC signal frequency; CMOS layout design; Hspice simulation; MWNT humidity sensor detection; SiO2; frequency 5 kHz to 50 kHz; humidity sensing unit on-chip surface; interface ASIC circuit; level capacitance detection; multiwall carbon nanotubes; phase sensitive demodulation; reliability; single chip integration design; size 0.5 mum; standard IC process; testing system; thin film humidity sensor; Application specific integrated circuits; Capacitance; Electrodes; Humidity; Resistance; Sensors; Testing; capacitance detection; humidity sensor; multiwall carbon nanotubes (MWNTs); single chip integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronics and Microelectronics (ICOM), 2012 International Conference on
  • Conference_Location
    Changchun, Jilin
  • Print_ISBN
    978-1-4673-2638-4
  • Type

    conf

  • DOI
    10.1109/ICoOM.2012.6316317
  • Filename
    6316317