• DocumentCode
    3493549
  • Title

    Analysis of IC fabrication processes using self-organizing maps

  • Author

    Rüping, S. ; Müller, J.

  • Author_Institution
    Heinz Nixdorf Inst., Paderborn Univ., Germany
  • Volume
    2
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    631
  • Abstract
    The analysis of integrated circuit (IC) fabrication processes is an important task in order to optimize the yield and to detect problems in very early state. Neural networks seem to be a promising approach to data analysis, especially when there is a large amount of data with many nonlinearities. In this paper we describe the use of self-organizing maps (SOM) for visualization and analysis of data derived from a running IC production of the Robert Bosch GmbH Waferfab at Reutlingen, Germany. The main aspects are techniques for pressure sensor trimming and online process monitoring for in-process data, parameters and the process status. After a short description of visualization techniques for SOM, we present the results based on the real world data from the Waferfab
  • Keywords
    integrated circuit manufacture; IC fabrication; Robert Bosch GmbH Waferfab; data analysis; data visualization; neural networks; online process monitoring; pressure sensor trimming; self-organizing maps;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Artificial Neural Networks, 1999. ICANN 99. Ninth International Conference on (Conf. Publ. No. 470)
  • Conference_Location
    Edinburgh
  • ISSN
    0537-9989
  • Print_ISBN
    0-85296-721-7
  • Type

    conf

  • DOI
    10.1049/cp:19991181
  • Filename
    818002