DocumentCode
3493549
Title
Analysis of IC fabrication processes using self-organizing maps
Author
Rüping, S. ; Müller, J.
Author_Institution
Heinz Nixdorf Inst., Paderborn Univ., Germany
Volume
2
fYear
1999
fDate
1999
Firstpage
631
Abstract
The analysis of integrated circuit (IC) fabrication processes is an important task in order to optimize the yield and to detect problems in very early state. Neural networks seem to be a promising approach to data analysis, especially when there is a large amount of data with many nonlinearities. In this paper we describe the use of self-organizing maps (SOM) for visualization and analysis of data derived from a running IC production of the Robert Bosch GmbH Waferfab at Reutlingen, Germany. The main aspects are techniques for pressure sensor trimming and online process monitoring for in-process data, parameters and the process status. After a short description of visualization techniques for SOM, we present the results based on the real world data from the Waferfab
Keywords
integrated circuit manufacture; IC fabrication; Robert Bosch GmbH Waferfab; data analysis; data visualization; neural networks; online process monitoring; pressure sensor trimming; self-organizing maps;
fLanguage
English
Publisher
iet
Conference_Titel
Artificial Neural Networks, 1999. ICANN 99. Ninth International Conference on (Conf. Publ. No. 470)
Conference_Location
Edinburgh
ISSN
0537-9989
Print_ISBN
0-85296-721-7
Type
conf
DOI
10.1049/cp:19991181
Filename
818002
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