Title :
Variation of the de-embedded via hole discontinuity due to the resonance of power/ground planes
Author :
Kim, Li-jin ; Kim, Su-han ; Lee, Jae-hyun
Author_Institution :
Dept. of Radio Sci. & Eng., Chungnam Nat. Univ., Daejeon
Abstract :
This paper analyze the effect of resonance of power/ground planes on the characteristic of the via discontinuity. The calculation of characteristic of via discontinuity from de-embedding technique is an efficient and fast method. But, the effect of the via location on the via discontinuity characteristic must be taken into account because there are resonances of power/ground planes in multilayer PCBs. The characteristic of via discontinuity calculated from de-embedding technique is independent of the location of the via. However, each resonant mode of power/ground planes in multilayer PCBs may have the different distributions of electromagnetic fields between the power plane and the ground plane. Then, the via at the different location may give the different perturbation to the resonant field distribution, and so the characteristic of the via discontinuity may be changed. If the effect of the via location may be considered in the de-embedding methods, then the advantage of the fast extraction of the via discontinuity disappears.
Keywords :
printed circuits; de-embedding technique; multilayer PCB; power-ground planes; resonant field distribution; via discontinuity characteristics; Central Processing Unit; Electromagnetic compatibility; Electromagnetic fields; Equivalent circuits; Frequency measurement; Nonhomogeneous media; Numerical simulation; Power engineering and energy; Resonance; Resonant frequency;
Conference_Titel :
Microwave Conference, 2008. APMC 2008. Asia-Pacific
Conference_Location :
Macau
Print_ISBN :
978-1-4244-2641-6
Electronic_ISBN :
978-1-4244-2642-3
DOI :
10.1109/APMC.2008.4958690