DocumentCode :
349431
Title :
Boron nitride film deposition by reactive sputtering with ECR plasma
Author :
Wakatsuchi, M. ; Takaba, Y. ; Ueda, Y. ; Nishikawa, M.
Author_Institution :
Graduate Sch. of Eng., Osaka Univ., Japan
Volume :
2
fYear :
1999
fDate :
36495
Firstpage :
748
Abstract :
Boron nitride (BN) thin films have been synthesized. A pure boron target disk and a substrate are faced each other in an electron cyclotron resonance plasma source. A dc bias is applied to the target to sputter a target material with Ar/N2 plasmas. The substrate is rf biased to enhance ion bombardment during deposition. The BN films with the cubic phase as the dominant phase are obtained at the substrate self bias larger than 175 V under the condition of an ion to boron flux ratio of 12. However, these films show exfoliation and surface cracking. An intermediate layer deposited in Ar rich atmosphere makes these problems free on SEM observation
Keywords :
III-V semiconductors; boron compounds; crazing; plasma deposition; scanning electron microscopy; semiconductor growth; semiconductor thin films; sputter deposition; wide band gap semiconductors; 175 V; Ar; Ar/N2 plasma; BN; BN thin films; ECR plasma; N2; SEM; boron nitride film deposition; boron target disk; cubic phase; dc bias; electron cyclotron resonance plasma source; exfoliation; intermediate layer; ion bombardment; ion/boron flux ratio; reactive sputtering; substrate self bias; surface cracking; Argon; Boron; Cyclotrons; Electrons; Plasma materials processing; Plasma sources; Resonance; Sputtering; Substrates; Surface cracks;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
Type :
conf
DOI :
10.1109/IIT.1998.813775
Filename :
813775
Link To Document :
بازگشت