• DocumentCode
    3494333
  • Title

    MEMS structure with tunable stiffness using the magnetorheological effect

  • Author

    Fu-Ming Hsu ; Guang-Yu Liu ; Weileun Fang

  • Author_Institution
    Power Mech. Eng Dept., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    9
  • Lastpage
    12
  • Abstract
    This study presents a novel polymer MEMS structure with Fe3O4-glycerol fill-in. Thus, the concept of magnetorheological effect is exploited to increase the stiffness of polymer MEMS structure by applying a magnetic field. The stiffness enhancement by magnetic field is achieved through the following mechanisms: (1) distribution of the Fe3O4 particles in glycerol would change from isotropic to anisotropic, and (2) the attraction between the aligned Fe3O4 particles. Note the stiffness of structure could also be reduced by varying the direction of magnetic field. In applications, parylene beams with Fe3O4-glycerol fill-in have been fabricated and tested. Preliminary results show the critical buckling loads of beams increase from 0.6gw to 1.5gw (1% fill-in), 0.78gw to 2.3gw (3.8% fill-in), and 0.78gw to 2.6gw (5 % fill-in) by 5mT magnetic field. The resonant frequency of beam is reduced for 1.2 kHz in as magnetic field applied in x-direction. However, the resonant frequency of beam decreased for 2-3.3% as the magnetic field applied at y-and z-directions.
  • Keywords
    buckling; magnetic fields; magnetorheology; micromechanical devices; polymers; Fe3O4; critical buckling loads; frequency 1.2 kHz; glycerol fill-in; magnetic field; magnetorheological effect; polymer MEMS structure; resonant frequency; tunable stiffness enhancement; Magnetic field measurement; Magnetic fields; Magnetic resonance; Micromechanical devices; Perpendicular magnetic anisotropy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474163
  • Filename
    6474163