Title :
Study on surface swelling of SiC by high-dose He-ion implantation
Author :
Ohtsuka, S. ; Hasegawa, A. ; Satou, M. ; Abe, K.
Author_Institution :
Graduate Sch. of Eng., Tohoku Univ., Sendai, Japan
Abstract :
Surface modification of hard materials caused by implanting high-concentration He-ions is interesting since it may be applicable to their micro fabrication process. Implantation of He-ions with energies of 140 keV, 570 keV and 1.7 MeV in CVD-polycrystalline β-SiC was carried out at fluences from 1.4×1020 to 1.9×10 22 ions/m2 using a grid mesh to study the possibility of transcription of the grid mesh pattern to SiC. Irradiation temperature was about 300 to 400 K. Masking with a 25 μm grid mesh was used. After irradiation, swelling of the implanted area was estimated by the step-height method using a laser microscope. It was revealed that a mesh pattern was printed on the specimen surface by helium ion irradiation. Relatively large swelling was produced compared with those in other irradiation conditions in the fluence range greater than a few dpa. The height of upheaval pattern depended on the implanted He-ion fluence. Implanted energy dependence of the height was small for these experimental conditions. The transcribed pattern on the SiC surface was stable after annealing up to 1200°C when the implanted fluence was relatively low (1.8×1021 ions/m2)
Keywords :
CVD coatings; annealing; ion implantation; semiconductor doping; semiconductor thin films; silicon compounds; wide band gap semiconductors; 1.7 MeV; 140 keV; 300 to 400 K; 570 keV; SiC:He; annealing; high-dose He-ion implantation; laser microscope; mesh pattern; polycrystalline CVD films; step-height method; surface swelling; Degradation; Helium; Ion beams; Neutrons; Power engineering and energy; Silicon carbide; Surface morphology; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
DOI :
10.1109/IIT.1998.813783