Title :
Heat transfer analysis of micromachined thermal conductivity sensors
Author :
Beigelbeck, Roman ; Kohl, Franz ; Kuntner, Jochen ; Jakoby, Bernhard
Author_Institution :
Res. Unit for Integrated Sensor Syst., Austrian Acad. of Sci., Wiener Neustadt
Abstract :
Due to unique features, micromachined thermal sensors are an interesting alternative to classical macroscopic apparatuses for the determination of thermal conductivities. A typical drawback of sophisticated miniaturized sensing elements is the fact that for most devices no analytical solution of the heat conduction equation can be obtained and thus a numerical model has to be implemented to determine the thermal parameter(s) of interest. In this contribution, an analytical model of a micromachined sensor for measuring the thermal conductivity and diffusivity of different liquids is presented. The model not only accounts for the unique sensor geometry but also for additional spurious effects associated with the devices membrane
Keywords :
diffusion; heat conduction; microsensors; thermal conductivity; thermal conductivity measurement; diffusivity; heat conduction equation; heat transfer analysis; micromachined thermal conductivity sensors; Analytical models; Conductivity measurement; Equations; Heat transfer; Liquids; Numerical models; Sensor phenomena and characterization; Solid modeling; Thermal conductivity; Thermal sensors;
Conference_Titel :
Emerging Technologies and Factory Automation, 2005. ETFA 2005. 10th IEEE Conference on
Conference_Location :
Catania
Print_ISBN :
0-7803-9401-1
DOI :
10.1109/ETFA.2005.1612778