DocumentCode :
3494773
Title :
Non-Linear Gate Length Dependence of On-Current in Si-Nanowire FETs
Author :
Weber, W.M. ; Graham, A.P. ; Duesberg, G.S. ; Liebau, M. ; Cheze, C. ; Geelhaar, L. ; Unger, E. ; Pamler, W. ; Hoenlein, W. ; Riechert, H. ; Kreupl, F. ; Lugli, P.
Author_Institution :
Qimonda Dresden GmbH & Co.
fYear :
2006
fDate :
Sept. 2006
Firstpage :
423
Lastpage :
426
Abstract :
An extensive gate-length (LG) dependent electrical characterization of silicon nanowire (NW) field effect transistors (FET) is presented here. Catalytically-grown and nominally undoped Si-NWs were integrated as the active region of FETs, upon which fully silicided Schottky source and drain contacts were fabricated. The length of the active region was shortened by a desired value, through the lateral self-aligned formation of nickel silicide source- and drain-segments. All Si-NW FETs consisting of a single Si-NW with diameters between 10 and 30 nm display p-type behaviour and on/off-current ratios of up to 10 7. Devices with LGs below 1 mum and 21 nm NW-diameters all show the same on currents around 1 muA at 1 V drain-source biases. For LG > 1 mum the on-current decreases exponentially with increasing LG
Keywords :
Schottky barriers; elemental semiconductors; field effect transistors; nanowires; silicon; 1 V; 10 nm; 30 nm; Si; Si-nanowire FET; drain contacts; electrical characterization; field effect transistors; fully silicided Schottky source; lateral self-aligned formation; nickel silicide drain-segments; nickel silicide source-segments; nonlinear gate length dependence; p-type behaviour; silicon nanowire; Annealing; FETs; Fabrication; Lithography; Nanoelectronics; Nickel; Semiconductivity; Silicides; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 2006. ESSDERC 2006. Proceeding of the 36th European
Conference_Location :
Montreux
ISSN :
1930-8876
Print_ISBN :
1-4244-0301-4
Type :
conf
DOI :
10.1109/ESSDER.2006.307728
Filename :
4099946
Link To Document :
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