Title :
Experimental and simulation analysis of single and differential signals changing layers
Author :
Norman, Adam J. ; Schaffer, Mike ; Chen, Juan ; Ilavarasan, Ponniah
Author_Institution :
Intel Corp., USA
Abstract :
The physical effects surrounding the transition of a signal trace from one layer to another in a PCB design is studied both experimentally and numerically. This fundamental understanding is central to motherboard designs that are free from signal integrity and EMC/EMI deficiencies. The effects due to return current path discontinuities, current coupling, trace coupling and reference plane are considered. The results are interpreted from both a signal integrity (flight times and signal quality) and EMC/EMI standpoints. The findings will help drive better design practices into the PCB world
Keywords :
electromagnetic compatibility; electromagnetic coupling; electromagnetic interference; printed circuit design; EMC deficiencies; EMI deficiencies; PCB design; current coupling; differential signals; reference plane; return current path discontinuities; signal integrity; signal transition; single signals; trace coupling; Analytical models; Capacitors; Electromagnetic compatibility; Electromagnetic interference; Power transmission lines; Routing; Signal analysis; Signal design; Solid modeling; Testing;
Conference_Titel :
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-6569-0
DOI :
10.1109/ISEMC.2001.950563
