Title :
Silicon nanowire and cantilever electromechanical switches with integrated piezoresistive transducers
Author :
Rui Yang ; Tina He ; Marcoux, C. ; Andreucci, P. ; Duraffourg, L. ; Feng, Philip X.-L
Author_Institution :
Electr. Eng., Case Western Reserve Univ., Cleveland, OH, USA
Abstract :
This digest paper reports experimental demonstration of a new type of nanoelectromechanical device, combining contact-mode nanomechanical switching with sensitive integrated strain gauges in suspended thin (sub-100nm) silicon nanowires (SiNWs). By measuring and modeling the interesting coupling effects between mechanical strain and electrical transport in highly piezoresistive (PZR) thin SiNWs at room temperature, we demonstrate that, in both doubly-clamped SiNWs and mechanically `cross´ coupled cantilever-SiNW structures, contact-mode and tunneling switching with multiple repeatable cycles can be also simultaneously monitored and read out in the SiNW PZR transducers naturally embedded in the devices. Given the strong piezoresistive effects in thin SiNWs, this type of devices offer a new approach for monitoring contact-mode operations, and may prove valuable when the nanoscale contacts are not highly conductive, or degrading over time.
Keywords :
cantilevers; elemental semiconductors; nanoelectromechanical devices; nanowires; piezoresistive devices; silicon; strain gauges; transducers; Si; cantilever electromechanical switches; contact-mode nanomechanical switching; contact-mode operation monitoring; coupling effects; doubly-clamped thin-silicon nanowire; electrical transport; highly-piezoresistive thin-silicon nanowire; integrated piezoresistive transducers; mechanical strain; nanoelectromechanical device; nanoscale contacts; piezoresistive effects; sensitive integrated strain gauges; silicon-NW PZR transducers; suspended thin-silicon nanowires; Current measurement; Logic gates; Nanoelectromechanical systems; Nanoscale devices; Strain; Switches; Voltage measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474219