A room temperature, zero force, wafer-level attachment method for MEMS integration

This paper presents a wafer level attachment method for handling various shaped structures for MEMS processes, using parylene as an interlayer material. In this method, a handle wafer containing pillars and perforations is utilized, and structures are attached to the handle wafer through a parylene coating process realized at room temperature with no applied force. It is observed that pillars with 20 μm height, 2.5 mm side length, and 4.5 mm spacing can successfully be used to attach two 4" substrates to each other. The shear strength between the attached substrates is measured as 0.49 MPa, proving the feasibility of the method for integrating various materials into MEMS processes.