A full-wave characterization of PCB having various ground plane shapes

Author

Drissi, M. ; Elkandoussi, M. ; Kergonou, G. ; Zak, T. ; Xavier, C.

Author_Institution

INSA, Rennes, France

Volume

2

fYear

2001

fDate

2001

Firstpage

1213

Abstract

An integral equation technique solved by the method of moment (MoM) is proposed to characterize planar interconnection lines printed on a dielectric substrate backed by a finite size arbitrarily ground plane shape. The ground plane topology effect on the current return is firstly highlighted thanks to the calculated current distribution. The effect of the finite size of the ground plane is then analyzed and evaluated on the propagation characteristics. The theoretical results of the radiated field are then compared with measurements where a good agreement is observed

Keywords

electromagnetic coupling; electromagnetic wave propagation; integral equations; interconnections; method of moments; printed circuit design; substrates; PCB design; coupling; current distribution; current return; dielectric substrate; far field radiation; finite size arbitrarily ground plane shape; integral equation technique; method of moment; planar interconnection lines; propagation characteristics; Conductors; Current distribution; Dielectric substrates; Electromagnetic modeling; Integral equations; Integrated circuit interconnections; Message-oriented middleware; Moment methods; Shape; Strips;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on

Conference_Location

Montreal, Que.

Print_ISBN

0-7803-6569-0

Type

conf

DOI

10.1109/ISEMC.2001.950606

Filename

950606