• DocumentCode
    3495964
  • Title

    Single-step fabrication of superhydrophobic micro/nano dual-scale PDMS film replicated from ultra-low-surface-energy mold

  • Author

    Xiao-Sheng Zhang ; Bai-Hong Jin ; Shi-Gan Chu ; Peter, Nicolas ; Fu-Yun Zhu ; Hai-Xia Zhang

  • Author_Institution
    Nat. Key Lab. of Nano/Micro Fabrication Technol., Peking Univ., Beijing, China
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    331
  • Lastpage
    334
  • Abstract
    This paper reports a single-step process to fabricate superhydrophobic micro/nano dual-scale (MNDS) poly(dimethylsiloxane) (PDMS) membrane replicated directly from ultra-low-surface-energy MNDS silicon substrate at high temperature without surfactant coating. MNDS silicon surface with ultra-low surface energy was simply fabricated by an improved deep reactive ion etching (DRIE) process. The huge reduction of surface energy and the formation of high-density nanostructures (i.e. nanotips) on well-designed microstructures (i.e. inverted pyramids and V-shape grooves) were realized simultaneously due to the enhancement of passivation step of DRIE process. Therefore, the high-temperature thermal cross-linking process, even higher than 180°C, can be directly utilized on the pattern replication of PDMS without surfactant coating to strengthen the precision. After studying of heating temperature and time, the MNDS PDMS membrane with the static contact angle (CA) of ~151° was realized at the optimized temperature of 85°C after 1-hour heating. The plasma treatment of the same improved DRIE process was utilized to enhance the hydrophobicity. The CA achieved up to more than 160°, while the CA hysteresis was reduced to below 10°.
  • Keywords
    elemental semiconductors; hydrophobicity; membranes; microfabrication; nanofabrication; passivation; silicon; sputter etching; CA hysteresis; MNDS PDMS membrane; MNDS silicon surface; Si; V-shape grooves; heating temperature; high-density nanostructures; high-temperature thermal cross-linking process; improved DRIE process; improved deep reactive ion etching process; inverted pyramids; passivation step enhancement; pattern replication; plasma treatment; single-step fabrication process; static contact angle; superhydrophobic MNDS poly(dimethylsiloxane) membrane; superhydrophobic micro-nano dual-scale PDMS film; temperature 85 degC; time 1 hour; ultralow-surface energy mold; ultralow-surface-energy MNDS silicon substrate; well-designed microstructures; Coatings; Nanostructures; Plasma temperature; Silicon; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474245
  • Filename
    6474245