Interconnect and substrate modeling and analysis: an overview

Author

Chiprout, Eli

Author_Institution

IBM Austin Res. Lab., Austin, TX., USA

fYear

1997

fDate

28-30 Sep 1997

Firstpage

158

Lastpage

165

Abstract

Accurate models for metal interconnect, silicon substrate and packaging have become necessary for accurate simulation of high-speed designs. An overview of the hierarchy of techniques used to model and simulate these structures is given. While not an exhaustive summary, the purpose of the paper is to give the designer fundamental and practical understanding of principles used in modeling and analysis

Keywords

circuit analysis computing; digital simulation; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit modelling; integrated circuit packaging; substrates; high-speed designs; interconnect modeling; metal interconnect; modeling; packaging; simulation techniques hierarchy; substrate modeling; Bonding; Circuit simulation; Coupling circuits; Distributed parameter circuits; Integrated circuit interconnections; Maxwell equations; Packaging; RLC circuits; Semiconductor device modeling; Silicon;

fLanguage

English

Publisher

ieee

Conference_Titel

Bipolar/BiCMOS Circuits and Technology Meeting, 1997. Proceedings of the

Conference_Location

Minneapolis, MN

ISSN

1088-9299

Print_ISBN

0-7803-3916-9

Type

conf

DOI

10.1109/BIPOL.1997.647425

Filename

647425

Link To Document

https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3496048