Title :
DC and AC electrothermal charicterization of heated microcantilevers using scanning thermoreflectance microscopy
Author :
Joohyun Kim ; Sunwoo Han ; Keunhan Park ; Bong-Jae Lee ; King, William P. ; Jungchul Lee
Author_Institution :
Dept. of Mech. Eng., Sogang Univ., Seoul, South Korea
Abstract :
We report the application of scanning thermoreflectance microscopy for steady - as well as periodic-temperature calibration of a microheater-integrated atomic force microscope cantilever (or heated microcantilever). While the heated microcantilever was operated with either DC or AC powers, local thermoreflectance signals were measured using a home-built scanning thermoreflectance microscope and converted into local temperatures using a calibration with Raman thermometry. For our scanning thermoreflectance microscopy, temporal resolution of 10 μs and spatial resolution of 2 μm were achieved. The shrinkage of the AC temperature oscillation amplitude was observed as the modulation frequency increased and thermal cut-off frequency near 1 kHz was found. In addition, strong thickness-dependent thermoreflectance signals were experimentally confirmed and might be useful for noncontact thickness measurements of free standing microelectromechanical systems devices having uniform temperatures.
Keywords :
atomic force microscopy; calibration; cantilevers; micromechanical devices; shrinkage; thermometers; thermoreflectance; Raman thermometry; ac electrothermal properties; dc electrothermal properties; free standing microelectromechanical systems devices; heated microcantilevers; local thermo-reflectance signals; microheater-integrated atomic force microscope cantilever; oscillation amplitude; periodic-temperature calibration; scanning thermoreflectance microscopy; shrinkage; thickness-dependent thermoreflectance signals; Atomic force microscopy; Frequency modulation; Heating; Nanoscale devices; Silicon; Temperature measurement;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474265