• DocumentCode
    3496424
  • Title

    DC and AC electrothermal charicterization of heated microcantilevers using scanning thermoreflectance microscopy

  • Author

    Joohyun Kim ; Sunwoo Han ; Keunhan Park ; Bong-Jae Lee ; King, William P. ; Jungchul Lee

  • Author_Institution
    Dept. of Mech. Eng., Sogang Univ., Seoul, South Korea
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    409
  • Lastpage
    412
  • Abstract
    We report the application of scanning thermoreflectance microscopy for steady - as well as periodic-temperature calibration of a microheater-integrated atomic force microscope cantilever (or heated microcantilever). While the heated microcantilever was operated with either DC or AC powers, local thermoreflectance signals were measured using a home-built scanning thermoreflectance microscope and converted into local temperatures using a calibration with Raman thermometry. For our scanning thermoreflectance microscopy, temporal resolution of 10 μs and spatial resolution of 2 μm were achieved. The shrinkage of the AC temperature oscillation amplitude was observed as the modulation frequency increased and thermal cut-off frequency near 1 kHz was found. In addition, strong thickness-dependent thermoreflectance signals were experimentally confirmed and might be useful for noncontact thickness measurements of free standing microelectromechanical systems devices having uniform temperatures.
  • Keywords
    atomic force microscopy; calibration; cantilevers; micromechanical devices; shrinkage; thermometers; thermoreflectance; Raman thermometry; ac electrothermal properties; dc electrothermal properties; free standing microelectromechanical systems devices; heated microcantilevers; local thermo-reflectance signals; microheater-integrated atomic force microscope cantilever; oscillation amplitude; periodic-temperature calibration; scanning thermoreflectance microscopy; shrinkage; thickness-dependent thermoreflectance signals; Atomic force microscopy; Frequency modulation; Heating; Nanoscale devices; Silicon; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474265
  • Filename
    6474265