Title :
Properties of Pt/Cr layers due to fabrication conditions and thermal characteristics
Author :
Yi, Seung Hwan ; Jin, H.S. ; Kim, B.W. ; Sung, Y.K.
Author_Institution :
Mando R&D Center, South Korea
Abstract :
In this paper, we studied the electrical and structural properties of Pt/Cr layers to fabricate the micro hot-plate for the first time. Increasing the Cr layer´s thickness caused sheet resistance to decrease. When the Cr layer has 800 Å thickness, its sheet resistance is 17.7 Ω/□ and the Pt/Cr layer´s sheet resistance is not affected by the Cr layer´s thickness. When we annealed the Pt/Cr layer in Ar ambient varying the temperature from 500°C to 700°C, its sheet resistance varies from 2.026 Ω/□ to 0.6317 Ω/□. Also, we analyzed the Pt/Cr layer´s properties according to the annealing conditions by XRD and AES depth profiles. We fabricated the micro hot-plate using the Pt/Cr layer by micromachining technology, and we measured it´s thermal characteristics by IR thermo-vision system
Keywords :
Auger effect; X-ray diffraction; annealing; chromium; gas sensors; infrared imaging; micromachining; microsensors; platinum; 500 to 700 degC; 800 angstrom; AES depth profiles; IR thermo-vision system; Pt-Cr; XRD; annealing conditions; fabrication conditions; gas sensors; micro hot-plate; micromachining technology; microsensors; sheet resistance; thermal characteristics; Annealing; Chromium; Electric resistance; Electrical resistance measurement; Fabrication; Gas detectors; Temperature; Thermal conductivity; Thermal stresses; X-ray scattering;
Conference_Titel :
Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
Conference_Location :
Penang
Print_ISBN :
0-7803-3388-8
DOI :
10.1109/SMELEC.1996.616484
