DocumentCode :
3496779
Title :
Self-curling and -sticking flexible substrate for ECoG electrode array
Author :
Yamagiwa, Shinichi ; Ishida, Makoto ; Kawano, T.
Author_Institution :
Dept. of Electr. & Electron. Inf. Eng., Toyohashi Univ. of Technol., Toyohashi, Japan
fYear :
2013
fDate :
20-24 Jan. 2013
Firstpage :
480
Lastpage :
483
Abstract :
We report a flexible electrocorticogram (ECoG) electrode array device with one directionally self-curling and -sticking properties, to solve the difficulty of the handling of thin (<; 10 μm) substrate devices (Fig. 1). As the substrate, we use sandwiched parylene-N/-C which films have different linear expansion coefficients. The thermal dependences of the deflection and curvature radius of the paylene-N/-C system were calculated. Based on the calculations, 2.5-μm parylene-N/2.5-μm paryelen-C “bi-parylene” flexible substrate was prepared. The self-curled substrate with the curvature radius of about 2 mm has been observed. The self-sticking of the curled device has been demonstrated on wet samples, due to the surface tension between the parylene-N and the sample. These results suggest that the bi-parylene substrate becomes a candidate material for easy-to-use flexible thin ECoG devices, enchaining the wrapping property over the brain.
Keywords :
bending; bioelectric phenomena; biomedical electrodes; electroencephalography; materials preparation; polymers; substrates; surface tension; biparylene flexible substrate; brain; curvature radius; flexible electrocorticogram electrode array device; flexible thin ECoG devices; linear expansion coefficients; parylene-C; sandwiched parylene-N-C system; self-curling flexible substrate; self-sticking flexible substrate; size 2.0 mm; size 2.5 mum; surface tension; thermal dependences; thin substrate device handling; wrapping property; Arrays; Electrodes; Films; Humans; Impedance; Plasmas; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
ISSN :
1084-6999
Print_ISBN :
978-1-4673-5654-1
Type :
conf
DOI :
10.1109/MEMSYS.2013.6474283
Filename :
6474283
Link To Document :
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