• DocumentCode
    3496848
  • Title

    In-plane fabricated insulated gold-tip probe for electrochemical and molecular experiments

  • Author

    Yexian Wu ; Akiyama, Toyokazu ; Gautsch, S. ; van der Wal, P.D. ; de Rooij, Nico F.

  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    492
  • Lastpage
    495
  • Abstract
    In this contribution we present a scanning probe with a gold-tip completely encapsulated with insulator all the way to the apex. The probe fabrication is unique owing to an in-plane arrangement in which the width of the cantilever is defined by deep reactive ion etching (DRIE). E-beam lithography was employed for defining the gold nanowire tip. The cantilever and the chip body were defined by DRIE in later steps. The radius of curvature of the tip apex is around 20 nm. The high-quality insulation on the tip was demonstrated by performing electrodeposition of gold. The spring constant of the cantilever was obtained by measuring the resonance frequency of the cantilever. With this in-plane fabrication process, probes with different spring constants ranging from 0.1 N/m to 9 N/m were fabricated on the same wafer.
  • Keywords
    cantilevers; electrodeposition; electron beam lithography; gold; insulation; nanofabrication; nanowires; scanning probe microscopy; sputter etching; Au; cantilever; chip body; deep reactive ion etching; e-beam lithography; electrochemical experiments; gold electrodeposition; gold nanowire tip; high-quality insulation; inplane fabricated insulated gold-tip probe; inplane fabrication process; insulator; molecular experiments; probe fabrication; radius 20 nm; resonance frequency; scanning probe; spring constant; tip apex; Fabrication; Force measurement; Gold; Passivation; Probes; Springs; Voltage measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474286
  • Filename
    6474286