DocumentCode
3497086
Title
The bridging effect of the isolation moat on the EMI caused by ground bounce noise between power/ground planes of PCB
Author
Hwang, Jiunn-Nan ; Wu, Tzong-Lin
Author_Institution
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume
1
fYear
2001
fDate
2001
Firstpage
471
Abstract
Based on the FDTD modeling approach, the bridging effect of the isolation moat on the EMI caused by ground bounce noise is investigated. We find that isolating the noise source by the slits (or moats) is effective to eliminate the EMI, but bridges connecting between two sides of the slits will significantly degrade the effect of EMI protection. The measured and modeled results of the EMI strength at 3 m are compared and they are quite consistent
Keywords
electromagnetic interference; finite difference time-domain analysis; printed circuits; 3 m; EMI; EMI protection; EMI strength; FDTD modeling; PCB; bridging effect; ground bounce noise; isolation moat; noise source isolation; power/ground planes; Bridge circuits; Circuit noise; Digital circuits; Electromagnetic compatibility; Electromagnetic interference; Etching; Finite difference methods; Joining processes; Resonant frequency; Time domain analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-6569-0
Type
conf
DOI
10.1109/ISEMC.2001.950686
Filename
950686
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