Title :
A 3-DOF piezoelectric micro vibratory stage based on bulk-PZT/silicon crab-leg suspensions
Author :
Aktakka, Ethem E. ; Peterson, Rebecca L. ; Najafi, Khalil
Author_Institution :
Center for Wireless Integrated MicroSensing & Syst. (WIMS), Univ. of Michigan, Ann Arbor, MI, USA
Abstract :
This paper reports the simulation, fabrication and characterization of a 3-DOF piezoelectric micro vibratory stage design with large X/Y-tilting and Z-translational motion capabilities. The vibratory stage utilizes four piezoelectric crab-leg suspensions formed of bulk-PZT/Si unimorph beams in a L-shaped layout. FEA simulations are utilized to optimize the PZT/Si thickness ratio and characterize the 3-DOF actuation modes and off-axis coupling. A 3×3-mm2 sized stage is fabricated via a process that includes bonding and thinning of bulk-PZT substrates on pre-patterned silicon features and micro-patterning of thick PZT films via wet etching. At ±25 V static excitation, X-tilting and Y-tilting angle ranges are measured as >2.3°, and Z-translational displacement is 42 μm. At resonance, the tilting angle range is 12.2° (~1.77 kHz), and the vertical displacement range is 387 μm (0.93 kHz). The device consumes only 100 μW and <;450 μW during static and resonant operation, respectively.
Keywords :
bonding processes; elemental semiconductors; finite element analysis; lead compounds; microactuators; microfabrication; piezoelectric actuators; silicon; titanium compounds; zirconium compounds; 3-DOF actuation modes; 3-DOF piezoelectric microvibratory stage design; FEA simulations; L-shaped layout; PZT; Si; X-Y-tilting capability; Z-translational displacement; Z-translational motion capability; bulk-PZT substrates; bulk-PZT-silicon crab-leg suspensions; micr-patterning; off-axis coupling; power 100 muW; pre-patterned silicon features; static excitation; unimorph beams; wet etching; Couplings; Optical device fabrication; Optical imaging; Resonant frequency; Silicon; Suspensions;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474307