Title :
Hybrid FDTD-SPICE analysis of radiated emission from PCB with integrated circuits
Author :
Nishizawa, A. ; Kobidze, G. ; Tanabe, S.
Author_Institution :
Adv. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
The radiated emission from ground bouncing and transmission lines have been analyzed using the finite difference time domain (FDTD) and SPICE hybrid method. This method can consider both the nonlinear electric characteristics of IC and the distributed parameters of printed circuit boards (PCB). The computed results of the electric field at 3 m from the PCB were validated by the measurements. The hybrid tool allows calculation of the noise spectrum and radiation pattern. Another advantage is that this method can separate the contributions of various noise sources. This analysis tool and methodology is useful to design transmission lines and power/ground planes in PCB
Keywords :
SPICE; electric fields; electromagnetic interference; finite difference time-domain analysis; integrated circuit modelling; printed circuits; 3 m; EMI; PCB; distributed parameters; electric field; electromagnetic interference; finite difference time domain; ground bouncing; hybrid FDTD-SPICE analysis; integrated circuits; noise sources; noise spectrum calculation; nonlinear electric characteristics; power/ground planes design; radiated emission; radiation pattern; transmission lines; Distributed parameter circuits; Electric variables; Electric variables measurement; Finite difference methods; Integrated circuit noise; Power transmission lines; Printed circuits; SPICE; Time domain analysis; Transmission line measurements;
Conference_Titel :
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-6569-0
DOI :
10.1109/ISEMC.2001.950704
