Heterogeneous integration of nano enabling devices for 3D ICs

Author

Li Wang ; Rui Ma ; Chen Zhang ; Zongyu Dong ; Xin Wang ; Zitao Shi ; Jian Liu ; Lin Lin ; Hui Zhao ; Fei Lu ; Qiang Fang ; Chen Yang ; Jing Zhan ; Tianling Ren ; Xinxin Li ; Ru Huang ; Wang, Aiping

Author_Institution

Dept. of EE, Univ. of California, Riverside, Riverside, CA, USA

fYear

2013

fDate

4-6 Sept. 2013

Firstpage

249

Lastpage

254

Abstract

For decades, advances in integrated circuits (IC) have been driven by continuous scaling down of planar IC technologies. As IC scaling rapidly approaches to technical brick wall, 3D IC heterogeneous integration emerges as a viable solution for future integrated electronics. Future complex system-on-a-chip (SoC) requires high-performance active devices, and novel passive and supporting devices. This paper reviews recent advances in develop 3D magnetic-enhanced inductors and 3D on-chip electrostatic discharging (ESD) structures to achieve heterogeneous 3D ICs with high performance and reliability simultaneously.

Keywords

electrostatic discharge; inductors; integrated circuit reliability; nanoelectronics; system-on-chip; three-dimensional integrated circuits; 3D IC heterogeneous integration; 3D integrated circuits; 3D magnetic-enhanced inductors; 3D on-chip electrostatic discharging structures; ESD; integrated circuit reliability; nano enabling devices; planar IC technology; system-on-a-chip; Electrostatic discharges; Inductors; Magnetic cores; Nanoscale devices; Programming; System-on-chip; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Low Power Electronics and Design (ISLPED), 2013 IEEE International Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4799-1234-6

Type

conf

DOI

10.1109/ISLPED.2013.6629304

Filename

6629304