• DocumentCode
    3497856
  • Title

    Crosstalk characterization of high-speed interconnects in time-domain

  • Author

    Kuo, Chun-Chin ; Lin, Yen-Hui ; Wu, Tzong-Lin

  • Author_Institution
    Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
  • Volume
    1
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    657
  • Abstract
    As the edge rate becomes faster in digital signals, signal integrity (SI) analysis, such as reflection, delay, and crosstalk becomes increasingly important. This paper proposes an efficient modeling approach, which combines the finite-difference time-domain (FDTD) method and multi-conductor layer peeling technique for differential transmission lines, to extract the equivalent model and the characteristic impedance of the differential transmission lines. These extracted models can be employed to predict the crosstalk of the high-speed signals
  • Keywords
    SPICE; crosstalk; digital circuits; digital signals; electromagnetic interference; finite difference time-domain analysis; interconnections; transmission line theory; EMI; FDTD method; characteristic impedance; common/differential impedance profile; crosstalk; delay; differential transmission lines; digital signals; edge rate; equivalent model; finite-difference time-domain method; high-speed interconnects; lumped SPICE model; multi-conductor layer peeling technique; reflection; signal integrity analysis; Crosstalk; Digital circuits; Distributed parameter circuits; Finite difference methods; Impedance; Multiconductor transmission lines; SPICE; Testing; Time domain analysis; Transmission lines;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
  • Conference_Location
    Montreal, Que.
  • Print_ISBN
    0-7803-6569-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2001.950724
  • Filename
    950724