Title :
Crosstalk characterization of high-speed interconnects in time-domain
Author :
Kuo, Chun-Chin ; Lin, Yen-Hui ; Wu, Tzong-Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Abstract :
As the edge rate becomes faster in digital signals, signal integrity (SI) analysis, such as reflection, delay, and crosstalk becomes increasingly important. This paper proposes an efficient modeling approach, which combines the finite-difference time-domain (FDTD) method and multi-conductor layer peeling technique for differential transmission lines, to extract the equivalent model and the characteristic impedance of the differential transmission lines. These extracted models can be employed to predict the crosstalk of the high-speed signals
Keywords :
SPICE; crosstalk; digital circuits; digital signals; electromagnetic interference; finite difference time-domain analysis; interconnections; transmission line theory; EMI; FDTD method; characteristic impedance; common/differential impedance profile; crosstalk; delay; differential transmission lines; digital signals; edge rate; equivalent model; finite-difference time-domain method; high-speed interconnects; lumped SPICE model; multi-conductor layer peeling technique; reflection; signal integrity analysis; Crosstalk; Digital circuits; Distributed parameter circuits; Finite difference methods; Impedance; Multiconductor transmission lines; SPICE; Testing; Time domain analysis; Transmission lines;
Conference_Titel :
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location :
Montreal, Que.
Print_ISBN :
0-7803-6569-0
DOI :
10.1109/ISEMC.2001.950724