• DocumentCode
    3497860
  • Title

    Low-voltage low-overhead asynchronous logic

  • Author

    Sridharan, Arun ; Sechen, Carl ; Jafari, Roozbeh

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2013
  • fDate
    4-6 Sept. 2013
  • Firstpage
    261
  • Lastpage
    266
  • Abstract
    A new delay-bounded asynchronous logic technique aimed at maximizing reliability at very low voltages is proposed. Compared to previous asynchronous logic approaches, the area and nominal delay overheads are small. Conventional standard cell libraries and conventional logic synthesis tools are used. The bounding delay elements used by the asynchronous controller feature programmable delays that are initially set based on static timing analysis. However, the delay elements are updated on-the-fly during actual operation of the circuit, resulting in strong resiliency even at low voltages and with extreme variations. Several benchmark circuits were implemented with the new asynchronous design flow using the 45nm TI process. Monte Carlo analysis demonstrates the expected resiliency. Compared to the equivalent synchronous circuits, the asynchronous versions have area overheads averaging 40%, although much smaller for large circuits. Nominal delay overheads average about 10%.
  • Keywords
    Monte Carlo methods; asynchronous circuits; integrated circuit reliability; logic design; low-power electronics; Monte Carlo analysis; area overhead; asynchronous controller; asynchronous design flow; bounding delay elements; delay-bounded asynchronous logic; logic synthesis tools; low-voltage low-overhead asynchronous logic; nominal delay overhead; programmable delays; size 45 nm; standard cell libraries; static timing analysis; Benchmark testing; Delays; Flip-flops; Libraries; Logic gates; Radiation detectors; Throughput; Asynchronous logic; de-synchronization; low voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Low Power Electronics and Design (ISLPED), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4799-1234-6
  • Type

    conf

  • DOI
    10.1109/ISLPED.2013.6629306
  • Filename
    6629306