DREAM: a chip-package co-design tool for RF-mixed signal systems

Author

Nayak, Ghanshyam ; Das, Tejasvi ; Rao, T.M. ; Mukund, P.R.

Author_Institution

Rochester Inst. of Technol., NY, USA

fYear

2004

fDate

19-20 Feb. 2004

Firstpage

207

Lastpage

210

Abstract

´Package aware´ IC design has not only become advantageous, but also essential towards optimum performance of high-end systems. Here, an early design tool has been presented that can assist a designer in chip-package co-design of RF and mixed signal systems. The primary function of this tool is to correlate metrics in the chip and package domain. The tool allows modifications of RF standard CMOS circuits based on package effects and in analyzing package power distribution. It evaluates the effect of package power supply noise on RF circuits in detail. The analysis can be used either to change the RF/mixed signal design or the packaging technology used for both simultaneously depending upon the application.

Keywords

CMOS integrated circuits; integrated circuit design; mixed analogue-digital integrated circuits; packaging; power distribution; power supply circuits; radiofrequency integrated circuits; DREAM; RF standard CMOS circuits; RF-mixed signal systems; chip-package co-design tool; early design tool; high-end systems; optimum performance; package aware IC design; package effects; package power distribution; package power supply noise; packaging technology; CMOS technology; Circuit noise; Coupling circuits; Integrated circuit noise; Packaging; Power distribution; RF signals; Radio frequency; Signal analysis; Signal design;

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI, 2004. Proceedings. IEEE Computer society Annual Symposium on

Print_ISBN

0-7695-2097-9

Type

conf

DOI

10.1109/ISVLSI.2004.1339531

Filename

1339531