Title :
Piezoelectric rubber films for human physiological monitoring and energy harvesting
Author :
Tsai, Jui-che ; Wang, Jiacheng ; Su, Yu-Chuan
Author_Institution :
Dept. of Eng. & Syst. Sci., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Abstract :
We have successfully demonstrated the fabrication of piezoelectric rubber films and their applications in heartbeat sensing and human energy harvesting. To realize the desired stretchability and electromechanical sensitivity, cellular PDMS structures with micrometer-sized voids are internally implanted with bipolar charges, which are secured by PTFE surface coating. The resulting composite structures show an elastic modulus about 300 kPa and a piezoelectric coefficient d33 higher than 1000 pC/N. With a pressure sensitivity of 10 mV/Pa, the sensing of heartbeat is demonstrated. Furthermore, multiple piezoelectric films are stacked to form an energy harvester that can charge solid-state energy storages. With a 10-kilogram load over a 10-cm2 projected area, a 4-layer stacked structure can deliver a charge of 0.4 μC per cycle. As such, the piezoelectric rubber films can function as both sensing and powering elements, and potentially realize the integration of human physiological monitoring and energy harvesting.
Keywords :
biological techniques; elastic moduli; energy harvesting; microfabrication; microsensors; patient monitoring; physiology; piezoelectric thin films; piezoelectricity; polymer films; rubber; thin film sensors; PTFE surface coating; bipolar charge; cellular PDMS structure; composite structure; elastic modulus; electromechanical sensitivity; heart beat sensing; human energy harvesting; human physiological monitoring; micrometer sized void; piezoelectric coefficient; piezoelectric rubber film fabrication; pressure sensitivity; solid state energy storage; stretchability; Films; Monitoring; Partial discharges; Piezoelectricity; Rubber; Sensors; Surface treatment;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474374