DocumentCode :
3498830
Title :
Reliability Issues in SiGe HBTs Fabricated on CMOS-Compatible Thin-Film SOI
Author :
Bellini, Marco ; Chen, Tianbing ; Zhu, Chendong ; Cressler, John D. ; Cai, Jin
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
fYear :
2006
fDate :
8-10 Oct. 2006
Firstpage :
1
Lastpage :
4
Abstract :
A comprehensive investigation of reliability issues in both fully-depleted and partially-depleted SiGe HBTs-on-SOI is presented. The devices were subjected to "mixed-mode" stress at 300 K and at 77 K, and the changes in base current IB, collector resistance Rc , M-1, and AC performance were analyzed. A comparison of mixed-mode stress to conventional reverse EB bias stress is also made, and significant differences are observed. The thermal resistance Rth of the devices is extracted over the 50 K - 300 K range
Keywords :
CMOS integrated circuits; Ge-Si alloys; heterojunction bipolar transistors; semiconductor device reliability; silicon-on-insulator; thin film circuits; 50 to 300 K; AC performance; CMOS-compatible thin-film SOI; HBT; SiGe; base current; collector resistance; heterojunction bipolar transistor; mixed-mode stress; reliability issues; thermal resistance; CMOS technology; Doping; Germanium silicon alloys; Heterojunction bipolar transistors; Performance analysis; Silicon germanium; Substrates; Thermal stresses; USA Councils; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Bipolar/BiCMOS Circuits and Technology Meeting, 2006
Conference_Location :
Maastricht
ISSN :
1088-9299
Print_ISBN :
1-4244-0458-4
Electronic_ISBN :
1088-9299
Type :
conf
DOI :
10.1109/BIPOL.2006.311155
Filename :
4100223
Link To Document :
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