A flexible implantable micro temperature sensor on polymer capillary for biomedical applications

Author

Zhuoqing Yang ; Yi Zhang ; Itoh, Takayuki

Author_Institution

Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan

fYear

2013

fDate

20-24 Jan. 2013

Firstpage

889

Lastpage

892

Abstract

A flexible implantable micro temperature sensor has been proposed and fabricated on a polymer capillary by surface micromachining. The dynamic temperature response of the sensor when used in the hyperthermia is simulated and analyzed. The micro sensor has been successfully fabricated by our developed cylindrical projection lithography system. Platinum film is used as the sensing element material considering its good stability and linear resistance-temperature relationship. The temperature coefficient of resistance (TCR) and the current-voltage curves of the sensor prototype have been tested and evaluated. The test average TCR value derived from the fitted line is 0.0035/°C, which has a good agreement with industry standard value of the bulk Pt resistor sensor. The present flexible micro temperature sensor could be widely used as a precise implantable monitoring device in various biomedical applications.

Keywords

bioMEMS; capillarity; hyperthermia; metallic thin films; micromachining; microsensors; patient monitoring; platinum; polymers; temperature sensors; thin film resistors; thin film sensors; ultraviolet lithography; Pt; biomedical applications; bulk Pt resistor sensor; current-voltage curves; cylindrical projection lithography system; dynamic temperature response; flexible implantable microtemperature sensor; hyperthermia; implantable monitoring device; industry standard value; linear resistance-temperature relationship; platinum film; polymer capillary; sensing element material; sensor prototype; surface micromachining; temperature coefficient-of-resistance; Films; Polymers; Resists; Substrates; Temperature measurement; Temperature sensors;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on

Conference_Location

Taipei

ISSN

1084-6999

Print_ISBN

978-1-4673-5654-1

Type

conf

DOI

10.1109/MEMSYS.2013.6474386

Filename

6474386