• DocumentCode
    3499128
  • Title

    Adaptive regridding for high temperature electrothermal device simulations

  • Author

    Chang, Mi-Chang ; Chern, Jue-Hsien

  • Author_Institution
    Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
  • fYear
    1993
  • fDate
    1993
  • Firstpage
    142
  • Lastpage
    146
  • Abstract
    The problems of prematured snapback and false multiple breakdown are found in simulating semiconductor devices in the high temperature region. The only way to achieve accurate and efficient electrothermal simulation under these conditions is by adaptive regridding. An adaptive regridding algorithm that approaches the optimal efficiency by applying the equidistribution of local truncation error is developed. With this algorithm both problems are overcome. In addition, both simulation accuracy and efficiency are improved by at least a factor of two.
  • Keywords
    digital simulation; electronic engineering computing; mesh generation; semiconductor device models; adaptive regridding; algorithm; electrothermal device simulations; equidistribution; false multiple breakdown; high temperature; local truncation error; optimal efficiency; prematured snapback; semiconductor device simulation; Computational modeling; Computer errors; Contacts; Electric breakdown; Electrothermal effects; Finite wordlength effects; Semiconductor device breakdown; Semiconductor devices; Temperature; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications, 1993. Proceedings of Technical Papers. 1993 International Symposium on
  • Conference_Location
    Taipei, Taiwan
  • ISSN
    1524-766X
  • Print_ISBN
    0-7803-0978-2
  • Type

    conf

  • DOI
    10.1109/VTSA.1993.263646
  • Filename
    263646