DocumentCode
3499128
Title
Adaptive regridding for high temperature electrothermal device simulations
Author
Chang, Mi-Chang ; Chern, Jue-Hsien
Author_Institution
Semicond. Process & Design Center, Texas Instrum. Inc., Dallas, TX, USA
fYear
1993
fDate
1993
Firstpage
142
Lastpage
146
Abstract
The problems of prematured snapback and false multiple breakdown are found in simulating semiconductor devices in the high temperature region. The only way to achieve accurate and efficient electrothermal simulation under these conditions is by adaptive regridding. An adaptive regridding algorithm that approaches the optimal efficiency by applying the equidistribution of local truncation error is developed. With this algorithm both problems are overcome. In addition, both simulation accuracy and efficiency are improved by at least a factor of two.
Keywords
digital simulation; electronic engineering computing; mesh generation; semiconductor device models; adaptive regridding; algorithm; electrothermal device simulations; equidistribution; false multiple breakdown; high temperature; local truncation error; optimal efficiency; prematured snapback; semiconductor device simulation; Computational modeling; Computer errors; Contacts; Electric breakdown; Electrothermal effects; Finite wordlength effects; Semiconductor device breakdown; Semiconductor devices; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications, 1993. Proceedings of Technical Papers. 1993 International Symposium on
Conference_Location
Taipei, Taiwan
ISSN
1524-766X
Print_ISBN
0-7803-0978-2
Type
conf
DOI
10.1109/VTSA.1993.263646
Filename
263646
Link To Document