Title :
High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices
Author :
Chung-Hsuan Wang ; Cho-Lun Hsu ; Wen-Cheng Chiu ; Tung-Yen Lai ; Tong-Huan Chou ; Yang, I. ; ChiaHua Ho ; Chenming Hu ; Fu-Liang Yang ; Chou, Y.C.
Author_Institution :
Nat. Nano Device Labs. (NDL), Nat. Appl. Res. Labs. (NARL), Taipei, Taiwan
Abstract :
The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.
Keywords :
DNA; bioMEMS; entropy; molecular biophysics; nanoelectromechanical devices; sieving; 3D artificial nanochannel matrices; DNA sieving sensitivity; MEMS; NEMS; entropic trapping; high sensitivity DNA sieving technology; portable bioelectronic instruments; through-silicon-via-semiconductor technologies; time 6 min; voltage 8 V; wafer scale fabrication; Charge carrier processes; DNA; Data mining; Fabrication; Laboratories; Nanoscale devices; Sensitivity;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474389
