High sensitivity DNA sieving technology by entropic trapping in 3D artificial nano-channel matrices

Author

Chung-Hsuan Wang ; Cho-Lun Hsu ; Wen-Cheng Chiu ; Tung-Yen Lai ; Tong-Huan Chou ; Yang, I. ; ChiaHua Ho ; Chenming Hu ; Fu-Liang Yang ; Chou, Y.C.

Author_Institution

Nat. Nano Device Labs. (NDL), Nat. Appl. Res. Labs. (NARL), Taipei, Taiwan

fYear

2013

fDate

20-24 Jan. 2013

Firstpage

899

Lastpage

902

Abstract

The highest reported sensitivity (35%) of DNA sieving by entropic trapping has been achieved with a low operation voltage of 8V, and short time of 6 minutes. Wafer scale fabrication of 3D artificial nano-channel matrices is based on proven NEMS, MEMS, and Through-Si-Via (TSV) semiconductor technologies and offers high potential for application in portable bioelectronic instruments. A mechanism based on entropic trapping is proposed for the observed high DNA sieving sensitivity by 3D artificial nano-channel matrices.

Keywords

DNA; bioMEMS; entropy; molecular biophysics; nanoelectromechanical devices; sieving; 3D artificial nanochannel matrices; DNA sieving sensitivity; MEMS; NEMS; entropic trapping; high sensitivity DNA sieving technology; portable bioelectronic instruments; through-silicon-via-semiconductor technologies; time 6 min; voltage 8 V; wafer scale fabrication; Charge carrier processes; DNA; Data mining; Fabrication; Laboratories; Nanoscale devices; Sensitivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on

Conference_Location

Taipei

ISSN

1084-6999

Print_ISBN

978-1-4673-5654-1

Type

conf

DOI

10.1109/MEMSYS.2013.6474389

Filename

6474389