DocumentCode
3499499
Title
Optimization of doping process on P-type wafer using spin-on technique
Author
Lim, C.S. ; Kuan, S.H. ; Ibrahim, K.
Author_Institution
Intel Technol. Sdn. Bhd., Penang, Malaysia
fYear
1996
fDate
26-28 Nov 1996
Firstpage
280
Lastpage
283
Abstract
Measurement of junction depth (Xj) value with respect to change in spin time, dopant volume and spin velocity during spin-on-doping process was obtained using groove and stain method. Theoretically, junction depth depends only on temperature and diffusion time. However, the result of this project indicate that spin time, spin velocity and dopant volume will also affect the value of junction depth
Keywords
diffusion; semiconductor doping; diffusion; groove method; junction depth; optimization; p-type wafer; spin-on doping; stain method; Doping; Glass; Hafnium; Iron; Nitrogen; P-n junctions; Physics; Pollution measurement; Silicon; Temperature dependence;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
Conference_Location
Penang
Print_ISBN
0-7803-3388-8
Type
conf
DOI
10.1109/SMELEC.1996.616498
Filename
616498
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