DocumentCode :
3499499
Title :
Optimization of doping process on P-type wafer using spin-on technique
Author :
Lim, C.S. ; Kuan, S.H. ; Ibrahim, K.
Author_Institution :
Intel Technol. Sdn. Bhd., Penang, Malaysia
fYear :
1996
fDate :
26-28 Nov 1996
Firstpage :
280
Lastpage :
283
Abstract :
Measurement of junction depth (Xj) value with respect to change in spin time, dopant volume and spin velocity during spin-on-doping process was obtained using groove and stain method. Theoretically, junction depth depends only on temperature and diffusion time. However, the result of this project indicate that spin time, spin velocity and dopant volume will also affect the value of junction depth
Keywords :
diffusion; semiconductor doping; diffusion; groove method; junction depth; optimization; p-type wafer; spin-on doping; stain method; Doping; Glass; Hafnium; Iron; Nitrogen; P-n junctions; Physics; Pollution measurement; Silicon; Temperature dependence;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics, 1996. ICSE '96. Proceedings., 1996 IEEE International Conference on
Conference_Location :
Penang
Print_ISBN :
0-7803-3388-8
Type :
conf
DOI :
10.1109/SMELEC.1996.616498
Filename :
616498
Link To Document :
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