DocumentCode :
3499909
Title :
Local oxidation process simulation in nanoscale MOS/CMOS structures
Author :
Andriukaitis, D. ; Anilionis, R.
Author_Institution :
Dept. of Electron. Eng., Kaunas Univ. of Technol.
fYear :
2006
fDate :
2-4 Oct. 2006
Firstpage :
1
Lastpage :
4
Abstract :
Problems of local oxidation, related with oxidation time, temperature, silicon oxide layer, patterned silicon nitride in MOS/CMOS structure was researched. During local oxidation of silicon most CMOS quality depends on gate channel shortening, diffusion region separation. Oxidation mathematical models are created using program SUPREM. It is determined, that most acceptable results are received when time t=12 min., temperature T=1000degC, SiO2 thickness = 4 nm., Si 3N4 thickness = 100 nm
Keywords :
CMOS integrated circuits; nanoelectronics; oxidation; silicon compounds; 100 nm; 1000 C; 12 mins; 4 nm; CMOS; SUPREM; Si3N4; SiO2; diffusion region separation; gate channel shortening; nanoscale MOS/CMOS structures; oxidation mathematical models; oxidation process simulation; oxidation time; patterned silicon nitride; silicon oxide layer; CMOS process; CMOS technology; Dielectrics; Fabrication; Isolation technology; MOSFETs; Oxidation; Production; Silicon; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Baltic Electronics Conference, 2006 International
Conference_Location :
Tallinn
ISSN :
1736-3705
Print_ISBN :
1-4244-0414-2
Electronic_ISBN :
1736-3705
Type :
conf
DOI :
10.1109/BEC.2006.311054
Filename :
4100275
Link To Document :
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