Fast interconnect parasitic extraction in deep submicron using bin-based algorithm

Presents a fast interconnect capacitance extraction tool (wire extractor) LASCA, which considers the lateral coupling, ground and crossover capacitances. Using the bin-based algorithm to extract connectivity, empirical formulation and a simple 2½D methodology, we provide a good trade-off between accuracy and efficiency when compared to traditional layout extraction. Comparisons between our wire extractor with the Diva extractor (Cadence design Systems), give an average difference of only 5% in the final delay of some benchmarks, being up to 30 times faster than Diva