Partnering works: a case in point (sputtering process)

Discusses a manufacturable process for sputter-depositing collimated Ti/TiN films. Prior to the project, the applicability of this technology to deep submicron geometries was postulated but unproven. The collimated sputtering process was characterized and optimized by using design of experiments. The step coverage, thickness uniformity, material properties, electrical resistivity, defect density and cost of ownership were studied. The manufacturability of the collimated deposition tool was proven with a controlled ´Marathon´. In addition to these specific project-related accomplishments, standard methods of reporting film resistivity were addressed.