Title :
3D Parylene sheath probes for reliable, long-term neuroprosthetic recordings
Author :
Kuo, Jonathan T. W. ; Kim, B.J. ; Hara, S.A. ; Lee, Curtis D. ; Yu, Long ; Gutierrez, C.A. ; Hoang, T.Q. ; Pikov, Victor ; Meng, Ellis
Author_Institution :
Univ. of Southern California, Los Angeles, CA, USA
Abstract :
Parylene C neural probes with a 3D sheath structure are introduced as a novel interface for long-term intracortical neural recording. 3D sheath structures were assembled from surface micromachined Parylene microchannels by thermoforming the thermoplastic around a solid microwire mold. Multiple Pt electrodes lined the interior and exterior of the sheath. Electrochemical characterization of the electrodes confirmed impedance values (50-250 KΩ at 1 kHz) suitable for neural recordings. A novel insertion approach was developed that temporarily stiffens the neural probes for surgical implantation and optimized in agarose brain tissue model. Sheath probes implanted into rat cortex recorded neural signals for four weeks. To achieve long-term, reliable recordings, the sheath structures will be coated with eluting neurotrophic factors to promote and attract neural ingrowth towards electrode sites.
Keywords :
biological tissues; biomedical electrodes; biomedical materials; brain; electrochemical electrodes; microchannel flow; microelectrodes; micromachining; neurophysiology; platinum; polymers; prosthetics; surgery; thermoforming; 3D parylene sheath probes; 3D sheath structure; Pt; agarose brain tissue model; electrochemical characterization; frequency 1 kHz; impedance values; insertion approach; long-term intracortical neural recording; multiple Pt electrodes; neural ingrowth; neurotrophic factors; novel interface; parylene C neural probes; rat cortex recorded neural signals; reliable long-term neuroprosthetic recordings; resistance 50 kohm to 250 kohm; self-assembly; solid microwire mold; surface micromachined parylene microchannels; surgical implantation; thermoforming; thermoplastic; time 4 week; Arrays; Electrodes; Fabrication; Materials; Probes; Reliability; Thermoforming;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4673-5654-1
DOI :
10.1109/MEMSYS.2013.6474435