• DocumentCode
    3500454
  • Title

    A learning-based autoregressive model for fast transient thermal analysis of chip-multiprocessors

  • Author

    Juan, Da-Cheng ; Zhou, Huapeng ; Marculescu, Diana ; Li, Xin

  • Author_Institution
    Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
  • fYear
    2012
  • fDate
    Jan. 30 2012-Feb. 2 2012
  • Firstpage
    597
  • Lastpage
    602
  • Abstract
    Thermal issues have become critical roadblocks for the development of advanced chip-multiprocessors (CMPs). In this paper, we introduce a new angle to view transient thermal analysis - based on predicting thermal profile, instead of calculating it. We develop a systematic framework that can learn different thermal profiles of a CMP by using an autoregressive (AR) model. The proposed AR model can serve as a fast alternative for predicting the transient temperature of a CMP with reasonably good accuracy. Experimental results show that the proposed AR model can achieve approximately 113X speed-up over existing thermal profile estimation methods, while introducing an error of only 0.8°C on average.
  • Keywords
    autoregressive processes; estimation theory; microprocessor chips; multiprocessing systems; thermal management (packaging); AR model; CMP; chip-multiprocessor; learning-based autoregressive model; thermal profile estimation method; transient temperature; transient thermal analysis; Accuracy; Adaptation models; Correlation; Fitting; Integrated circuit modeling; Predictive models; Transient analysis;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design Automation Conference (ASP-DAC), 2012 17th Asia and South Pacific
  • Conference_Location
    Sydney, NSW
  • ISSN
    2153-6961
  • Print_ISBN
    978-1-4673-0770-3
  • Type

    conf

  • DOI
    10.1109/ASPDAC.2012.6165027
  • Filename
    6165027