• DocumentCode
    3500778
  • Title

    A bead-in-droplet solution exchange system via continuous flow microfluidic railing

  • Author

    Iwai, Keisuke ; Sochol, Ryan D. ; Liwei Lin

  • Author_Institution
    Mech. Eng. Dept., Univ. of California, Berkeley, Berkeley, CA, USA
  • fYear
    2013
  • fDate
    20-24 Jan. 2013
  • Firstpage
    1203
  • Lastpage
    1206
  • Abstract
    A continuous flow, microfluidic railing system has been developed for the rapid and autonomous exchanges of bead and bead-in-droplet formations. Fluidic encapsulations of microparticles (e.g., microbeads and living cells) inside individual microdroplets provide various possibilities for chemical and biological applications. This work extends the bead-in-droplet technology from a single type droplet to a multiple-stage, different droplet solutions system. A micropost array railing system has been demonstrated to passively: (i) guide an array of bead-in-droplet in a “first” droplet solution to different liquid flows and release the microbeads from the droplets, and (ii) re-encapsulate the released microbeads in droplets containing a different, “second” droplet solution. Experimental results revealed successful continuous flow solution exchanges for water-in-oil droplets with size of about 60.2μm in diameter containing microbeads of 15μm in diameter.
  • Keywords
    drops; encapsulation; microfluidics; bead-in-droplet solution exchange system; bead-in-droplet technology; biological applications; chemical applications; continuous flow microfluidic railing system; continuous flow solution exchanges; droplet solutions system; fluidic encapsulations; liquid flows; microbeads; microdroplets; microparticles; micropost array railing system; single type droplet; size 15 mum; water-in-oil droplets; Arrays; Biology; Chemicals; Encapsulation; Junctions; Microfluidics; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2013 IEEE 26th International Conference on
  • Conference_Location
    Taipei
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4673-5654-1
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2013.6474468
  • Filename
    6474468