DocumentCode :
3501086
Title :
Forming-free resistive switching of TiOx layers with oxygen injection treatments
Author :
Hsieh, Chun-I ; Jao, Jui-Hsiu ; Chen, Wei-Chia ; Wu, Chang-Rong ; Shih, Neng-Tai
Author_Institution :
Adv. Technol. Dev. Div., Taipei County, Taipei, Taiwan
fYear :
2011
fDate :
25-27 April 2011
Firstpage :
1
Lastpage :
2
Abstract :
In terms of defect generation and redistribution, the electrical forming process and filamentary conduction lead conventional RRAM cells to low yield, high operation current, and large operation variations [1-3]. Recently, emerging RRAM cells based on the redox reaction mechanism were proposed to eliminate electrical forming process [4]. However, the endurance was below few thousands cycles and device reliability still remained issues. Moreover, variations in operation parameters and device characteristics could not be avoided unless complex material engineering and film stacks were conducted [5, 6]. In this work, we fabricated TiN/TiOx/TiN RRAM cells with a oxygen injection (OI) treatment to place excess oxygen ions into TiOx films and characterized their forming-free and bi-polar resistive switching. Maximum resistance ratio is above 104 and low set/reset current density is lower than 10 nA/um2. The capability of various resistance sates shows highly potential of multi level cell (MLC). Then resistive switching is also discovered by structural and electrical analyses showing the excess oxygen occupations of vacancies in TiOx layers.
Keywords :
random-access storage; RRAM cells; defect generation; defect redistribution; electrical forming process; filamentary conduction; forming-free resistive switching; multi level cell; oxygen injection treatments; redox reaction mechanism; Bonding; Capacitance; Ions; Resistance; Switches; Testing; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications (VLSI-TSA), 2011 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-8493-5
Type :
conf
DOI :
10.1109/VTSA.2011.5872234
Filename :
5872234
Link To Document :
بازگشت