DocumentCode :
3501210
Title :
Deep wet etching process of Pyrex glass for vacuum packaging
Author :
Shuai Shi ; Xuefang Wang ; Minghai Xu ; Yuzhe Wang ; Jiaojiao Yuan ; Sheng Liu
Author_Institution :
Sch. of Mech. Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
44
Lastpage :
48
Abstract :
In this paper, experiments were carried out to confirm that Copper layer was a feasible masking material during the wet etching process of Pyrex glass for vacuum packaging or 3D packaging. Our study revealed that the sputtered Chromium and Copper layers combination with the electroplated Copper layer is an ideal etching mask. The improvement of the corrosion solution produced some more reliable results. The maximum etching depth in the glass can be as high as 200μm along without pinholes and notch defects on the surface. It may have a long-term impact on MEMS development and applications.
Keywords :
copper; corrosion; electronics packaging; electroplating; etching; glass; masks; 3D packaging; MEMS development; Pyrex glass; corrosion solution; deep wet etching process; electroplated copper layer; ideal etching mask; masking material; sputtered chromium layer; vacuum packaging; Bonding; Copper; Glass; Packaging; Wet etching; Anodic bonding; Pyrex7740 glass; Vacuum packaging; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474565
Filename :
6474565
Link To Document :
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