• DocumentCode
    3501225
  • Title

    The development of low cost Through Glass Via (TGV) interposer using additive method for via filling

  • Author

    Yu Sun ; Daquan Yu ; Ran He ; Fengwei Dai ; Xiaofeng Sun ; Lixi Wan

  • Author_Institution
    Inst. of Microelectron., Beijing, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    49
  • Lastpage
    51
  • Abstract
    Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer was introduced. Different materials and process were compared. RF MEMS using TGV wafer was designed.
  • Keywords
    filling; micromechanical devices; three-dimensional integrated circuits; wafer level packaging; 3D integration packaging; RF MEMS; SiO2; TGV wafer; TGV wafer manufacturing; additive method; filling; low cost TGV interposer development; low cost through glass via interposer development; three-dimensional integration packaging; Glass; Lasers; Packaging; Polymers; Radio frequency; Substrates; Tungsten;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474566
  • Filename
    6474566
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3501225