Title :
The development of low cost Through Glass Via (TGV) interposer using additive method for via filling
Author :
Yu Sun ; Daquan Yu ; Ran He ; Fengwei Dai ; Xiaofeng Sun ; Lixi Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
Abstract :
Through Glass Via (TGV) is a new approch for Three-dimensional (3D) integration packaging. In this paper, a novel low cost process for manufacture TGV wafer was introduced. Different materials and process were compared. RF MEMS using TGV wafer was designed.
Keywords :
filling; micromechanical devices; three-dimensional integrated circuits; wafer level packaging; 3D integration packaging; RF MEMS; SiO2; TGV wafer; TGV wafer manufacturing; additive method; filling; low cost TGV interposer development; low cost through glass via interposer development; three-dimensional integration packaging; Glass; Lasers; Packaging; Polymers; Radio frequency; Substrates; Tungsten;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474566
