DocumentCode :
3501368
Title :
Voltage driving or current driving: Which is preferred for RRAM programming?
Author :
Lv, Hangbing ; Lian, Wentai ; Long, Shibing ; Liu, Qi ; Li, Yingtao ; Wang, Wei ; Wang, Yan ; Zhang, Sen ; Liu, Ming
Author_Institution :
Lab. of Nano-Fabrication & Novel Devices Integrated Technol., Chinese Acad. of Sci., Beijing, China
fYear :
2011
fDate :
25-27 April 2011
Firstpage :
1
Lastpage :
2
Abstract :
Voltage driving is a commonly used method to program the resistive switching memory. However, a question of whether voltage driving or current driving is preferred has never been answered. For periphery circuit design, one should first consider which kind of source should be adopted. In this work, we systematically evaluated the performance of Cu/HfO2/Pt memory device by using current sweeping or voltage sweeping to SET and RESET. The results show that, tight distribution of Roff and Vset can be achieved by using current driving to RESET, with effectively eliminating the intermediate resistance states. The possible reason for this improvement may arise from a positive-feedback of joule heat generation during RESET process. Besides, uniform Ron distribution can also be realized by current driving, due to more localized conductive filaments formation. The results demonstrate that the current driving method is an effective way to solve the uniformity issue of RRAM.
Keywords :
copper compounds; electric resistance; hafnium compounds; integrated circuit design; platinum compounds; random-access storage; Cu-HfO2-Pt; Joule heat generation; RRAM programming; current driving; current sweeping; intermediate resistance state; localized conductive filaments formation; memory device; periphery circuit design; reset process; resistive switching memory; voltage driving; voltage sweeping; Copper; Electrodes; Heating; Power generation; Programming; Resistance; Switches;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems and Applications (VLSI-TSA), 2011 International Symposium on
Conference_Location :
Hsinchu
ISSN :
1524-766X
Print_ISBN :
978-1-4244-8493-5
Type :
conf
DOI :
10.1109/VTSA.2011.5872248
Filename :
5872248
Link To Document :
بازگشت