CMOS nanoelectronics at the time of diversifications

Nanoelectronics linear scaling appeals for new 3D integration schemes enabling to continue Moore´s law. Unique opportunities exist to increase the devices performances, system complexity and reduce power consumption of mobile, handheld objects. Devices other than CMOS can be co-integrated with CMOS to interface the outside Multiphysics world (MEMS, sensors and actuators, RF devices, power devices,...) allowing new functionalities. 3D Wafer Level Packaging and System on a Wafer pave the way to these new routes.