• DocumentCode
    3501869
  • Title

    Interfacial reaction of heat-sink during vacuum and reflow soldering in space power electronics

  • Author

    Yarong Chen ; Meng Yang ; Binbin Zhang ; Rong An

  • Author_Institution
    Beijing Spacecrafts, Beijing, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    186
  • Lastpage
    188
  • Abstract
    The heat-sink interfacial reaction of Sn-90Pb, Sn-95Pb, Sn-37Pb solders are contrast with the Sn-3.0Ag-0.5Cu solder in vacuum soldering and reflow soldering in this paper, to find the matching solder combination. Results show that, Sn-90Pb, Sn-95Pb solders are not the good choices for Al2O3/MoCu in vacuum soldering. Sn-3.0Ag-0.5Cu and Sn-37Pb solders can be used in the vacuum soldering, and Sn-37Pb solder is the best choice as the leaded solders for space use.
  • Keywords
    heat sinks; power electronics; reflow soldering; Al2O3-MoCu; Sn-Ag-Cu; SnPb; heat sink interfacial reaction; reflow soldering; space power electronics; vacuum soldering; Coatings; Heating;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474597
  • Filename
    6474597
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3501869