Title :
Effect of functionalization of multi-walled carbon nanotubes with 4´-allyloxy-biphenyl-4-ol on electrical conductivity and mechanical properties of silicon resin nanocomposites
Author :
Xue Gao ; Dayong Gui ; Wentao Zeng ; Weiling Chen ; Jianhong Liu
Author_Institution :
Sch. of Chem. & Chem. Eng., Shenzhen Univ., Shenzhen, China
Abstract :
In order to improve electrical conductivity of electronic packaging materials, we synthesize 4´-allyloxy-biphenyl-4-ol (AOBPO) and use the AOBPO functionalized MWCNTs (A-MWCNTs) as fillers mixed with silicone resin to fabricate nanocomposites. The electrical and mechanical performances of the nanocomposites were investigated by using dynamic mechanical analysis (DMA) and integrated electrochemical analyzer. The results show that AOBPO can disperse carbon nanotubes via π-π interactions and has good compatibility with the silicone resin matrix. the A-MWCNTs/silicon resin nanocomposites has a higher electrical conductivity than the unfunctionalized MWCNTs(U-MWCNTs)/silicon resin nanocomposites, and A-MWCNTs/silicone resin nanocomposites has a lower storage modulus than the U-MWCNTs/silicon resin nanocomposites, These results prove the effect of functionalization of MWCNTs with AOBPO on the interfacial adhesion and dispersion between silicon resin and MWCNTs, Which is further confirmed by morphology study of fractured surfaces of nanocomposites by SEM.
Keywords :
adhesion; carbon nanotubes; elastic moduli; electrical conductivity; electrochemical analysis; electronics packaging; filled polymers; fracture; nanocomposites; nanofabrication; resins; scanning electron microscopy; silicon; silicones; π-π interactions; 4-allyloxy-biphenyl-4-ol; A-MWCNT-silicon resin nanocomposites; A-MWCNT-silicone resin nanocomposites; AOBPO functionalized MWCNT; DMA; SEM; U-MWCNT-silicon resin nanocomposites; dynamic mechanical analysis; electrical conductivity; electronic packaging materials; integrated electrochemical analyzer; interfacial adhesion; interfacial dispersion; multiwalled carbon nanotube functionalization effect; nanocomposite fabrication; nanocomposite fractured surfaces; silicon resin nanocomposite mechanical properties; silicone resin matrix; unfunctionalized MWCNT-silicon resin nanocomposites; Carbon; Conductivity; Lead; Nanocomposites; Reliability; Resins; Silicon; MWCNTs; electrical conductivity; electronic packaging; nanocomposites;
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
DOI :
10.1109/ICEPT-HDP.2012.6474607