• DocumentCode
    3502218
  • Title

    Benzoxazine-modified aluminum polymer high dielectric composites

  • Author

    Yuanrong Cheng ; Tianke Qi ; Yunxia Jin ; Dunying Deng ; Fei Xiao

  • Author_Institution
    Dept. of Mater. Sci., Fudan Univ., Shanghai, China
  • fYear
    2012
  • fDate
    13-16 Aug. 2012
  • Firstpage
    264
  • Lastpage
    266
  • Abstract
    Materials with high dielectric permittivity and low dielectric loss are important materials applied in electronic devices such as capacitors, gate dielectrics, memories, and power-storage devices. The polymer materials with good processability usually have low dielectric loss but low dielectric permittivity. Conventional high permittivity materials were prepared by introducing inorganic fillers such as BaTiO3, carbon black, silver and aluminum (Al) nanoparticles (NPs) into the polymers to improve the dielectric permittivity. However, large amount of fillers are difficult to be well dispersed in the organic polymer matrix, which may increase the dielectric loss. Herein, benzoxazine silane coupling agent (TES-BZ) was synthesized and used to modify the Al microparticles. The TES-BZ modified Al microparticles were characterized by FTIR and were introduced into benzoxazine/epoxy resins to prepare composite materials. Dielectric property measurement shows that the TES-BZ modified Al microparticles improved the dielectric permittivity and low down the dielectric loss.
  • Keywords
    Fourier transform spectra; barium compounds; carbon; dielectric losses; permittivity; polymers; resins; titanium compounds; BaTiO3; FTIR; TES-BZ modified Al microparticle; benzoxazine silane coupling agent; benzoxazine-epoxy resin; benzoxazine-modified aluminum polymer; capacitor; carbon black; dielectric composite; dielectric loss; dielectric permittivity; dielectric property measurement; electronic device; gate dielectrics; inorganic filler; memories; organic polymer matrix; permittivity material; polymer material; power-storage device; silver nanoparticle; Ceramics; Couplings; Dielectrics; Moon; Silicon; Surface waves; Vibrations;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
  • Conference_Location
    Guilin
  • Print_ISBN
    978-1-4673-1682-8
  • Electronic_ISBN
    978-1-4673-1680-4
  • Type

    conf

  • DOI
    10.1109/ICEPT-HDP.2012.6474614
  • Filename
    6474614