DocumentCode
3502218
Title
Benzoxazine-modified aluminum polymer high dielectric composites
Author
Yuanrong Cheng ; Tianke Qi ; Yunxia Jin ; Dunying Deng ; Fei Xiao
Author_Institution
Dept. of Mater. Sci., Fudan Univ., Shanghai, China
fYear
2012
fDate
13-16 Aug. 2012
Firstpage
264
Lastpage
266
Abstract
Materials with high dielectric permittivity and low dielectric loss are important materials applied in electronic devices such as capacitors, gate dielectrics, memories, and power-storage devices. The polymer materials with good processability usually have low dielectric loss but low dielectric permittivity. Conventional high permittivity materials were prepared by introducing inorganic fillers such as BaTiO3, carbon black, silver and aluminum (Al) nanoparticles (NPs) into the polymers to improve the dielectric permittivity. However, large amount of fillers are difficult to be well dispersed in the organic polymer matrix, which may increase the dielectric loss. Herein, benzoxazine silane coupling agent (TES-BZ) was synthesized and used to modify the Al microparticles. The TES-BZ modified Al microparticles were characterized by FTIR and were introduced into benzoxazine/epoxy resins to prepare composite materials. Dielectric property measurement shows that the TES-BZ modified Al microparticles improved the dielectric permittivity and low down the dielectric loss.
Keywords
Fourier transform spectra; barium compounds; carbon; dielectric losses; permittivity; polymers; resins; titanium compounds; BaTiO3; FTIR; TES-BZ modified Al microparticle; benzoxazine silane coupling agent; benzoxazine-epoxy resin; benzoxazine-modified aluminum polymer; capacitor; carbon black; dielectric composite; dielectric loss; dielectric permittivity; dielectric property measurement; electronic device; gate dielectrics; inorganic filler; memories; organic polymer matrix; permittivity material; polymer material; power-storage device; silver nanoparticle; Ceramics; Couplings; Dielectrics; Moon; Silicon; Surface waves; Vibrations;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location
Guilin
Print_ISBN
978-1-4673-1682-8
Electronic_ISBN
978-1-4673-1680-4
Type
conf
DOI
10.1109/ICEPT-HDP.2012.6474614
Filename
6474614
Link To Document