DocumentCode :
3502274
Title :
The preparation and properties of BaTiO3-carbon nanotube/polyimide three-phase composites by In-situ polymerization for flexible package circuit
Author :
Bo Zhang ; Wen Yin ; Yuan Lu ; Lixi Wan
Author_Institution :
Inst. of Microelectron., Beijing, China
fYear :
2012
fDate :
13-16 Aug. 2012
Firstpage :
272
Lastpage :
274
Abstract :
High-technology fields require new high-dielectric-permittivity materials. A three-phase composite with multiwall carbon nanotube (MWNT) and BaTiO3 particles embedded into polyimide (PI) substrates by in-situ polymerization. The BaTiO3-MWNT/PI composite with low dielectric loss displayed relatively high dielectric constant and good flexibility due to the low concentrations of MWNT and BaTiO3. The results can be explained that BaTiO3 would be beneficial for the formation of conductive network of MWNT in PI matrix. A new polyimide nanocomposite films as flexible capacitor packaging materials have been successfully developed with low-frequency dielectric constant of 16.8, and the dielectric loss of 0.057.
Keywords :
barium compounds; capacitors; carbon nanotubes; electronics packaging; filled polymers; flexible electronics; nanocomposites; permittivity; polymer films; polymerisation; titanium compounds; BaTiO3; MWNT; PI matrix; PI substrates; conductive network; dielectric constant; flexible capacitor packaging materials; flexible package circuit; high-dielectric-permittivity materials; high-technology fields; in-situ polymerization; low dielectric loss; multiwall carbon nanotube; polyimide nanocomposite films; polyimide substrates; polyimide three-phase composites; Abstracts; Dielectric losses; Liquids; Materials reliability; Polymers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 13th International Conference on
Conference_Location :
Guilin
Print_ISBN :
978-1-4673-1682-8
Electronic_ISBN :
978-1-4673-1680-4
Type :
conf
DOI :
10.1109/ICEPT-HDP.2012.6474616
Filename :
6474616
Link To Document :
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